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Semiconductor devices - Discrete devices - Part 4 - 2:Microwave diodes and transistors - Integrated-circuit microwave amplifiers - Blank detail specification
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Semiconductor devices - Discrete devices - Part 5: Optoelectronic devices
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Discrete semiconductor devices and integrated circuits - Part 5-1: Optoelectronic devices - General
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Discrete semiconductor devices and integrated circuits - Part 5-2: Optoelectronic devices - Essential ratings and characteristics
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Discrete semiconductor devices and integrated circuits - Part 5-3: Optoelectronic devices - Measuring methods
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Semiconductor devices - Part 6: Discrete devices - Thyristors
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Semiconductor devices - Discrete devices - Part 6:Thyristors - Section one:Blank detail specification for reverse blocking triode thyristors, ambient or case-rated, up to 100 A
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Semiconductor devices - Discrete devices - Part 6:Thyristors - Section two:Blank detail specification for bidirectional triode thyristors(triacs), ambient or case-rated, up to 100 A
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Semiconductor devices - Discrete devices - Part 6:Thyristors - Section three:Blank detail specification for reverse blocking triode thyristors, ambient and case-rated, for currents greater than 100 A
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Semiconductor devices - Discrete devices - Part 7: Bipolar transistors
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Semiconductor devices - Discrete devices - Part 8: Field-effect transistors
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Semiconductor devices - Part 14-1: Semiconductor sensors - Generic specification for sensors
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Semiconductor devices - Part 14-10: Semiconductor sensors - Performance evaluation methods for wearable glucose sensors
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Semiconductor devices - Integrated circuits - Part 1: General
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Semiconductor integrated circuits - Part 2:Digital integrated circuits Section One:Blank detail specification for bipolar monolithic digital integrated circuit gates (excluding uncommitted logic arrays)
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Semiconductor devices - Integrated circuits - Part 2: Digital integrated circuits - Section 2: Family specification for HCMOS digital integrated circuits, series 54/74 HC, 54/74 HCT, 54/74 HCU
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Semiconductor devices - Integrated circuits - Part 2:Digital integrated circuits - Section 3:Blank detail specification for HCMOS digital integrated circuits(series 54/74 HC, 54/74 HCT, 54/74 HCU)
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Semiconductor devices - Integrated circuits - Part 2:Digital integrated circuits - Section 4:Family specification for complementary MOS digital integrated circuits, series 4 000 B and 4 000 UB
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Semiconductor devices - Integrated circuits Part 2:Digital integrated circuits Section 5 - Blank detail specification for complementary MOS digital integrated circuits(series 4 000B and 4 000UB)
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Semiconductor devices - Integrated circuits - Part 2:Digital integrated circuits Section 6:Blank detail specification for microprocessor integrated circuits
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